The flooring is a dependable, cost-effective solution for static control. It expands the company's ESD products and aligns with its goal of delivering end-to-end solutions that support process ...

Same Sky’s Thermal Management Group has expanded its Peltier devices product line with the addition of new single-stage and multi-stage modules. The CP family of Peltier modules now offer sizes up to ...

The TLP579xH series is housed in a small SO6L package, contributing to improved flexibility in component placement on the PCB. Also, the new products feature a minimum creepage distance of 8mm and an ...

Mouser Electronics, Inc. now offers the new FS160x µPOL DC-DC converters from TDK. The FS160x µPOL DC-DC converters offer full telemetry and increased performance in a compact, power-dense package.

Harwin has extended its Kontrol lineup of connectors for industrial and embedded applications, adding through-hole retention further to enhance resilience and board-level reliability in harsh ...

A key advantage of SiC wafers for GaN chips is the high thermal conductivity, which is a major aid to heat management and ...

MIT researchers have developed an ultra-low-power 5G receiver chip that operates under one milliwatt while rejecting ...

Advantech has announced that its innovative AI camera, the ICAM-540, has successfully met the qualifications for AWS IoT Greengrass. This milestone highlights the camera’s advanced capabilities in ...

Magnachip Semiconductor Corporation has released a new 80V MXT MV MOSFET, MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package. The company has already begun supplying the new MOSFET ...

The CoolSiC MOSFETs 1200V G2 are available in two Q-DPAK configurations: a single switch and a dual half-bridge. Both variants are part of the company's broader X-DPAK top-side cooling platform. With ...

Inc. now stocks the OptiMOS 6 150V Power MOSFETs from Infineon Technologies. The MOSFETs feature industry-leading on-state ...

The MPU is equipped with a range of high-speed communication interfaces vital for edge devices. These include PCI Express 3.0 (two lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, ...