The rise of “sensors everywhere” is a precursor to accumulating large quantities of sensor profiles needed for effective ...
Abstract: This article presents an efficient approach for the simulation of thermoelectric coolers (TECs) employed in thermal management of electronic packaging. The solution domain is initially ...
Traditional testing methods, while reliable, often require months or years to validate seal performance under real-world ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback