Abstract: The double-sided cooling (DSC) power modules are sandwich packaging with more soldering interfaces, which suffer higher thermal-induced stress than traditional wire-bonding packaging.
Abstract: The Silicon Carbide (SiC) MOSFET is widely recognized for its exceptional performance attributes. However, two primary issues restrict the operational capabilities of SiC MOSFET power ...
Introduction: Cerebrovascular pathologies require rapid and accurate imaging interpretation to guide time-sensitive decisions in acute neurovascular care. Advanced 3D segmentation of CTA images offers ...
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