Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...
A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.
An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.
AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...
Researchers from SK hynix published a technical paper titled “StreamDQ: Near-Memory Weight DeQuantization in Custom HBM for Scalable AI Inference Acceleration.” The paper proposes StreamDQ for “a ...
Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...
Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...
Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...
Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...
As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.
Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking ...
As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.
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