Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...
The development of new environmental legislation such as the RoHS Directive, has raised many concerns, especially with respect to the fact that lead will effectively be prohibited in most electronics ...
WaveMax 8000 solder pallet material offers excellent mechanical strength at continuous operating temperature in excess of 180º C. It was designed for wave soldering and IR re-flow applications, so it ...
Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
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