The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via ...

Under the newly agreed partnership, Q-Neko, a project involving 16 European and Japanese partners, is set to receive $4m in ...

Siemens Cre8Ventures has announced a new partnership with Xiphera, a provider of hardware-based cryptographic solutions, ...

Chet Babla, Senior VP of Strategic Marketing at indie talks to Neil Tyler about developments in the automotive space.

OMRON Electronic Components Europe has introduced the G9EJH-1-E, an ultra-compact DC power relay, delivering inrush ...

Samsung, much like Intel, has been looking to close the gap with TSMC by landing major external orders for its 2nm node.

GaN (Gallium Nitride) technology innovator Finwave Semiconductor has announced a successful $8.2m bridge investment round.

Rambus has made available complete client chipsets for next-generation AI PC memory modules with two new PMICs.

Imec and TNO have officially launched the Holst Centre Photonics Lab, a state-of-the-art facility dedicated to integrated ...

Cadence's Tensilica NeuroEdge 130 AI Co-Processor (AICP) is a new class of processor designed to complement NPUs.

To overcome development challenges, wireless IoT developers need high-quality educational resources.

POLYN, a developer of Neuromorphic Analogue Signal Processing (NASP) technology, tapes out its first NASP chip.