Multi-beam mask writing was identified as one of the ways to eliminate hurdles to manufacturing curvilinear mask shapes in the last installment of this blog. Our blog series continues with an ...

Photomasks are becoming more complex at each node. In fact, masks are moving from traditional shapes to non-orthogonal patterns and complex shapes, such as curvilinear mask patterns. To measure ...

At the heart of advancing semiconductor chip technology lies a critical challenge: creating smaller, more efficient electronic components. This challenge is particularly evident in the field of ...

Some foundries require cut shapes to be aligned with respect to each other or to another layer. As shown in Figure 6, the Calibre Multi-Patterning tool automatically aligns the cut shapes between ...

The semiconductor industry began using multi-patterning technology to fabricate ICs at the 20-nm process node. When we got to 7 nm, the use of self-aligned multi-patterning (SAMP) techniques was ...