Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

KAOHSIUNG, April 15, 2026 /PRNewswire/ -- E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Brewer Science will exhibit at Booth #511 and is proud to serve as a Gold Sponsor of ECTC 2026. Company experts will be ...

Every cutting-edge AI accelerator, whether it carries an NVIDIA, AMD, or custom hyperscaler logo, must pass through a step ...

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the high-margin work under its own roof. Now, for the first time, the world’s ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Advanced packaging has created new process bottlenecks related to the internal mechanics of the packaging equipment. As ...