In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...

When it comes to FDM 3D prints and making them stronger, most of the focus is on the outer walls and factors like their layer adhesion. However, paying some attention to the often-ignored insides of a ...

Using novel theoretical and modeling tools such as finite element analysis can greatly accelerate widespread applications in many areas of nanotechnology. Polymer reinforcement using fillers is a ...

For the PDF version of this article, click here. The use of integrated magnetics is a promising technique to help reduce the size of the magnetic components, achieve ...